Industry Overview of Semiconductor Wafer Polishing and Grinding Equipment Market

Semiconductor wafer polishing and grinding equipment represent advanced and indispensable components that are generally used while fabricating semiconductor wafers. They usually comprise chemical and mechanical polishing machines, grinders, lappers, etc. Some of the common procedures that are performed by utilizing semiconductor wafer polishing and grinding equipment include deposition, etching, lithography, ion implant, cleaning, etc. They help in removing unwarranted material from a film and thin and refine the products while ensuring a smooth and damage-free surface. Consequently, semiconductor wafer polishing and grinding equipment find widespread applications in foundries, electronic devices, integrated database management systems or IDMs, memory manufacturing, etc.

How Big is the Semiconductor Wafer Polishing and Grinding Equipment Market?

The global semiconductor wafer polishing and grinding equipment market size reached US$ 410.1 Million in 2022. Looking forward, IMARC Group expects the market to reach US$ 559.1 Million by 2028, exhibiting a growth rate (CAGR) of 5.1% during 2023-2028.

Global Industry Trends and Drivers:

The expanding consumer electronics industry across the globe and the escalating demand for microelectromechanical systems or MEMS, microchips, and integrated circuits to manufacture smartphones, laptops, desktops, etc., are among the key factors driving the semiconductor wafer polishing and grinding equipment market. Additionally, the development of state-of-the-art technologies, such as metal-oxide-semiconductor (MOS) and chemical mechanical polishing (CMP), is acting as another significant growth-inducing factor. Besides this, the widespread adoption of polishing and grinding equipment in wafer fabrication plants to produce a system on a chip (SoC) dice is further stimulating the global market. Moreover, the rising integration of the Internet of Things (IoT) and Artificial Intelligence (AI), which enable leading manufacturers to engineer smart product variants, the inflating need for miniaturized devices, and the increasing investments in RD activities by key market players are expected to bolster the semiconductor wafer polishing and grinding equipment market over the forecasted period.

Key Market Segmentation:

The report provides detailed segmentation of the global semiconductor wafer polishing and grinding equipment market based on Type, End-user, and region.

Breakup by Type:

• Semiconductor Wafer Polishing Equipment
• Semiconductor Wafer Grinding Equipment

Breakup by End User:

• Foundries
• Memory Manufacturers
• IDMs
• Others

Breakup by Region:

• North America
  • United States
  • Canada
• Asia-Pacific
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Indonesia
  • Others
• Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
  • Russia
  • Others
• Latin America
  • Brazil
  • Mexico
  • Others
• Middle East and Africa

The report provides a comprehensive analysis of the industry key players listed below:

The Major Players in the market are Accretech (Europe) Gmbh (Tokyo Seimitsu Co. Ltd.), Amtech Systems Inc., Axus Technology, BBS Kinmei Co Ltd, Disco Corporation, Dynavest Pte Ltd, Ebara Corporation, Gigamat Technologies Inc., Lapmaster Wolters GmbH (Lapmaster International LLC), Logitech International S.A., Okamoto Machine Tool Works Ltd and Revasum Inc.